MAST Technologies Suppress-n-Sink™ 300 materials are a new set of advanced dual purpose materials to be used for EMI/RF suppression and thermal conductance. The materials are formulated for high thermal conductivity as well as EMI/RF attenuation across a broad frequency range. The high thermal conductivity enables designers to mount this material directly on top of a silicon chip for heat transfer while also suppressing electromagnetic energy.
Electrical Performance:
The performance plot above shows the typical electrical attenuation performance of this material. For more information on the test set-up, please contact a MAST Technologies engineer.
Typical Properties:
Thickness: 0.040″ (1.0mm)
Thermal Conductivity: 1.5 W/mK
Hardness: 24 Shore A
Color: Dark Grey
Operating Temperature: -60°F to 325°F
Downloads
Technical Data Sheet (.pdf)
Microwave Data (.xlsx)
Thermal Pad Heat Sink Sketch (.pptx)
| Weight | 2 lbs |
|---|---|
| Dimensions | 12 × 12 × 0.125 in |
| Adhesive | No |
| Frequency | 0.5 to 12 GHz |
| Thickness | 0.040" (1.02mm) |
| Product Type | Suppress-n-Sink |
| Product Size | 8.25"x11.5" (210x292mm) |
| Frequency Range | 0.05 to 1 GHz, 1 to 18 GHz |
| Thickness Range | 0.006" – 0.040" |