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Suppress-n-Sink™ 300 Series
Suppress the Emissions.
Sink the Heat.
Same Interface Material.
DUAL-FUNCTION EMI SUPPRESSION & THERMAL INTERFACE MATERIAL
As electronic systems shrink and clock faster, unwanted EMI and localized heat increasingly originate at the component itself. Traditional shielding and thermal solutions address these separately — adding complexity and stealing space. Suppress-n-Sink™ 300 Series combines RF absorption and thermal conductivity into a single sheet material that mounts directly on the component.
300 Series
Family
1 – 18 GHz
Coverage
Dual-Function
EMI + Thermal
AS9100D
Quality Certified
Dual-Function EMI Suppression & Thermal Interface
Two Component-Level Problems. Solved in One Material.
Suppress-n-Sink™ 300 Series materials are designed to mount directly onto electronic components — enabling localized emission suppression while supporting efficient heat dissipation in the same interface footprint.
The result: source-level mitigation that doesn’t require separate shielding and thermal hardware competing for the same board space.
COMMON APPLICATIONS
300 Series
Dual-Function Interface
EMI Absorption + Thermal Transfer
Mounted directly on the component — emissions suppressed at the source, heat moved away in the same material
How Suppress-n-Sink™ Works
Mount on the Component.
Absorb Emissions.
Transfer Heat.
Suppress-n-Sink™ 300 Series materials are placed in direct contact with radiating components — integrated circuits, high-speed devices, and other emission sources. By combining RF absorption with thermal conductivity in a single material, the interface reduces emissions before they propagate through the enclosure while simultaneously moving heat away from the component.
THIS APPROACH SUPPORTS
Performance & Test Methods
Performance Characterization — NRL Arch & Transmission Tunnel.
Electrical performance may be characterized using industry-standard RF test methods, depending on application and configuration. Both reflectivity and insertion-loss methodologies apply across the 1-18 GHz operating range.
Product Configurations
Sheet Form. Die-Cut or Kiss-Cut. Configured to the Component.
Suppress-n-Sink™ 300 Series materials are supplied in sheet form and can be cut to fit specific component geometries — either as fully die-cut individual interface pads or as kiss-cut sheets for assembly-line peel-and-place application.
Format
Sheet Material
Standard 8.25″ × 11.5″ (210 × 292 mm) sheets supplied in four thickness configurations.
Conversion
Die-Cut to Component
Cut to component geometry for direct application — IC top, package size, custom outlines.
Conversion
Kiss-Cut for Assembly
Partial cuts allow peel-and-place workflow on the assembly line without losing the carrier sheet.
Available Products
Four MS32 Configurations.
Pick Thickness. Mount on the Component.
All four MS32 part numbers share the same frequency coverage and sheet size — what varies between them is thickness. Match the thickness to the gap between your component and the next surface (enclosure wall, heatsink, or PCB).
Frequency Range — All Configurations
1 – 18 GHz
Sheet Size — All Configurations
8.25″ × 11.5″ (210 × 292 mm)
Adhesive — All Configurations
None (custom on request)
PART NUMBER
DESCRIPTION
THICKNESS
FREQUENCY
ADHESIVE
MS32-0001-00
Suppress-n-Sink™, 300 Series, 0.020″
0.020″ (0.51 mm)
1-18 GHz
—
MS32-0002-00
Suppress-n-Sink™, 300 Series, 0.040″
0.040″ (1.02 mm)
1-18 GHz
—
MS32-0003-00
Suppress-n-Sink™, 300 Series, 0.060″
0.060″ (1.52 mm)
1-18 GHz
—
MS32-0004-00
Suppress-n-Sink™, 300 Series, 0.080″
0.080″ (2.03 mm)
1-18 GHz
—
Greater thickness provides higher attenuation but consumes more component-to-enclosure clearance. Refer to individual Technical Data Sheets for configuration-specific electrical and thermal performance details. Custom die-cut shapes and kiss-cut conversions available on request.
Work With Our Engineers
Identify the Emission Source. Match the Material Thickness.
Suppress-n-Sink™ is most effective when selected with an understanding of both the EMI behavior and the thermal requirements at the component. MAST Technologies works closely with customers to identify the emission sources, characterize the thermal envelope, and optimize material selection for effective source-level mitigation without compromising the component-to-enclosure stack-up.
Engineering Question
Solving EMI and thermal at the same component?
Share the emission source, the operating frequency content, the thermal envelope, and the available stack-up clearance — our engineering team will identify the right MS32 thickness and conversion format for your application.
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