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Surface-Wave Absorbers (MR31 Series)
Suppress Surface-Propagating EMI.
At the Trace. At the Chassis.
SURFACE WAVE ABSORBERS
MAST Technologies’ MR31 Series absorbers are designed to suppress RF energy propagating along conductive surfaces — including PCB traces and chassis interfaces — reducing unintended coupling and surface-driven radiation in electronic systems.
MR31
Series Family
11
Datasheet Configurations
PSA-Backed
Placement Format
AS9100D
Quality Certified
RF Absorbers for Surface Wave & PCB-Level Emissions Control
When the Problem Lives at the Surface — Not the Cavity.
MR31 Series absorbers address EMI that originates at or near the surface level — emissions traveling along PCB traces, coupling across chassis interfaces, or radiating from conductive surfaces where volumetric cavity absorbers can’t reach.
Commonly used in electronic systems where the interference path is along the surface rather than inside an enclosed cavity.
COMMON APPLICATIONS
MR31 Series
Surface Wave Absorption
High-Impedance Attenuation — Right at the Conductive Surface.
Surface wave absorbers are placed directly on or near conductive surfaces to attenuate surface-propagating electromagnetic fields. This reduces coupling into nearby structures while minimizing impact on the circuit performance underneath.
The high-impedance nature of these materials is what makes them work: they absorb the surface-traveling field energy without significantly altering system behavior, signal integrity, or impedance characteristics of the underlying traces and ground planes.
Performance & Test Methods
Characterized Performance, Tested in Free Space.
MR31 Series electrical performance is characterized using free-space reflectivity testing methods. Full methodology and reflectivity data are documented in the Technical Bulletin referenced alongside.
Material & Configuration Options
Thin-Profile Sheets, Multiple Thicknesses, PSA-Backed for Placement.
01
Thin-Profile Sheet Formats
Low-clearance sheet construction designed for placement directly onto PCB surfaces, chassis interfaces, and tight enclosure envelopes where bulk absorbers cannot fit.
02
Multiple Thickness Options
Various thickness configurations available — matched to the surface-wave attenuation depth required and the clearance available at the placement location.
03
PSA-Backed Configurations
Pressure-sensitive adhesive backing for direct placement onto PCB surfaces, chassis sections, and structural conductive surfaces — no fasteners or secondary bonding required.
For configuration-specific performance details — refer to individual Technical Data Sheets below. Each MR31-series datasheet documents the formulation, thickness, and PSA configuration for that specific variant.
Technical Data Sheets
Browse the MR31 Series
Datasheet Library
Each MR31-series datasheet documents formulation, thickness, PSA configuration, and performance data for that specific variant. Click any datasheet below to download the PDF.
Work With Our Engineers
Placement Strategy & Material Selection for Surface-Level EMI.
Selecting the right MR31 configuration starts with understanding the interference band, the surrounding signal content you can’t afford to compromise, and the installation envelope you’re working within. Our engineering team helps you match formulation, thickness, and backing to your specific requirements.
Engineering Question
Need help with placement strategy or material selection?
Share the surface where the interference originates, the frequency content involved, and the available clearance — our engineering team will recommend the right MR31 variant and the optimal placement strategy for your application.
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