MAST Technologies Suppress-n-Sink™ 300 materials are a new set of advanced dual purpose materials to be used for EMI/RF suppression and thermal conductance. The materials are formulated for high thermal conductivity as well as EMI/RF attenuation across a broad frequency range. The high thermal conductivity enables designers to mount this material directly on top of a silicon chip for heat transfer while also suppressing electromagnetic energy.

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Electrical Performance:
The performance plot above shows the typical electrical attenuation performance of this material. For more information on the test set-up, please contact a MAST Technologies engineer.

Typical Properties:
Thickness: 0.060″ (1.5mm)
Thermal Conductivity: 1.5 W/mK
Hardness: 24 Shore A
Color: Dark Grey
Operating Temperature: -60°F to 375°F

Technical Data Sheet (.pdf)
Microwave Data (.xlsx)
Thermal Pad Heat Sink Sketch (.pptx)

Additional information

Weight 2 lbs
Dimensions 12 × 12 × 0.125 in